ADCMP563BCP-R2
Product Attributes
| Operating Temperature | -55°C ~ 155°C |
|---|---|
| Part Status | Last Time Buy |
| Number of Elements | 2 |
| Mounting Type | Surface Mount |
| Supplier Device Package | 16-LFCSP-WQ (3x3) |
| Output Type | Complementary |
| Circuit Type | Isolated |
| Number of Resistors | 2 |
| Resistor Matching Ratio | - |
| Resistor-Ratio-Drift | - |
| Number of Pins | 4 |
| Power Per Element | 62.5mW |
| Temperature Coefficient | ±200ppm/°C |
| Size / Dimension | 0.063" L x 0.063" W (1.60mm x 1.60mm) |
| Tolerance | ±1% |
| Grade | Automotive |
| Resistance (Ohms) | 470 |
| Voltage - Input Offset (Max) | 10mV @ 5V |
| Type | with Latch |
| Current - Input Bias (Max) | 10µA @ 5V |
| Current - Output (Typ) | 30mA |
| Qualification | AEC-Q200 |
| Package / Case | 16-WFQFN Exposed Pad, CSP |
| Height - Seated (Max) | 0.020" (0.50mm) |
| Hysteresis | ±1mV |
| CMRR, PSRR (Typ) | 80dB CMRR, 85dB PSRR |
| Propagation Delay (Max) | 0.83ns |
| Applications | DDRAM, SDRAM |
| Current - Quiescent (Max) | 5mA, 25mA |
| Voltage - Supply, Single/Dual (±) | 4.75V ~ 5.25V, ±2.375V ~ 2.625V |